描述
Automatic solder paste printer
Features:
1.Special adjustable jacking platform,stable and easy to adjust,it can quickly adjust the pin jacking height of PCB with different thickness.
2.Image and optical system,applicable for tin plating,coppering,gold plating,tin spraying,FPC and other types PCB with of different colors,able to ensure high accuracy.
3.Chinese/English Operating Interface.Adopts windows XP/Win7 operation interface with user friendly software.
4.Three cleaning system equipped with three cleaning methods:dry cleaning,wet cleaning,vacuum.
5.High adaptability steel mesh frame clamping system,able to print all kinds of size screen frames,and quickly change models during production line.
6.2D solder paste quality inspection and analysis system,immediately detects solder paste deposition defects such as deviation,lack paste,miss paste,paste joint etc,and guarantees print quality.
Performance:
| Machine Alignment Capability | 2Cmk @ ±12.5 microns 6 sigma |
| Process Alignment Capability | 2Cpk @ ±25 microns 6 sigma |
| Core Cycle Time (excluding printing & cleaning time) | < 8.5 secs |
| Product Changeover Time | < 3 mins |
| New Product Set-up Time | < 10 mins |
Board handling:
| Max. Size (L x W) | 400 mm x 340 mm |
| Min. Size (L x W) | 50 mm x 50 mm |
| Thickness | 0.4~6 mm |
| PCB Thickness Adjustment | Manual (Auto is option. PCB max. width reduced to 310 mm) |
| PCB Max. Weight | 3 kg |
| PCB Edge Clearance | 3 mm |
| PCB Bottom Clearance | 15 mm (7 mm with optional auto PCB thickness adjustment) |
| Clamping Method | Top clamp (manual) and motorized side clamp |
| Support Method | Magnetic support pins, bars, blocks, Vacuum suction |
| Conveyor Direction | L to R, R to L, R to R, L to (software control) |
| Conveyor Height | 900 ± 40 mm |
| Conveyor Speed | Max. 1,500 mm/s |
| Conveyor Width Adjustment | Automatic |
Operator interface:
| Hardware | LCD Monitor, Mouse & Keyboard |
| Operating System (OS) | Windows 7 or Higher |
| Control Method | Industrial PC controlled |
| I/O Interface | SMEMA Standard |
Facilities requirement:
| Power Supply | AC220V ± 10% 50/60Hz |
| Power Consumption | 2.5kW |
| Air Supply | 4 ~ 6Kgf/cm² |
| Dimension (excluding signal tower) | 1,158 mm (L) x 1,362 mm (W) x 1,463 mm (H) |
| Machine Weight | 1,000kg |
Optical system:
| Field-of-View (FOV) | 8 mm x 6 mm |
| Fiducial Types | Circle, triangle, square, diamond, cross |
| Fiducial size | 0.5~3.0 mm |
| Vision Methodology | CCD camera look up & down |
| 2D inspection | Max.100 windows to inspect missing & insufficient (std.) |
Printing parameters:
| Stencil Frame Size (L X W) | Adjustable, 470 mm x 370 mm to 737 mm x 737 mm |
| Printing Table Adjustment Range | X: ±3 mm, Y: ±7 mm : ± 2° |
| Print Speed | 6~200 mm/s |
| Squeegee Pressure | 0.5~10kg (program control) |
| Squeegee Type | Std.: Metal , Option: OPC, rubber |
| Print Gap (snap-off) | 0~20 mm |
| Squeegee Angle | Std. 60°, Option 45°, 50°, 55° |
| Cleaning System | Auto wet, dry, vacuum (software select) |
评价
目前还没有评论