描述
Economic lead free wave soldering machine
Features
- open canopy-style streamlined shell design, beautiful appearance, easy to clean.
- The lead-free solder furnace made of stainless steel production. High strength and hardness special aluminum rails, long lifespan;
- Applies to the PLC + touch screen controller, Ensure system reliability and stability;
- Spray system applies to the step motor , it can adjust the width according to the PCB size , save solder flux;
- Wave soldering stove adopt stepless electronic frequency control, it can independently control the wave height.
- The unique flux isolated device, flux fumes from the exhaust and recycling channel dedicated discharge, to meet environmental requirements.
- Programmable Automatic Turning the date, time, temperature and other parameters.
- equipped with a cooling module, the temperature compensation module, and a variety of process requirements for lead-freetechnique;
- The ceramic heating pipe preheating unit, fully stimulate the flux activity, to obtain good welding results. Radiation heat directly to the bottom of the PCB, heat, long life.
- Patented die-cast claw-type chain, titanium, non-stick tin, never deformation, long life, smooth and reliable transport PCB.
- The entire process transparent observation window for easy observation of the manufacturing and maintenance operations.
- Transportation system with stepless electronic speed control, PID control, transport speed and stability.
- Automatic start wave when go through the PCB, to minimize the amount of tin oxide.
- The temperature control system uses closed-loop PID control, temperature stable and reliable.
- With short circuit and overcurrent protection system.
Specifications
Model | OB-W330A |
PCB conveyor height | Max.760±10mm |
PCB conveyor direction | L-R |
PCB conveyor speed | 0-2.0m/min |
PCB Working width | 0~250mm adjustable (standard) |
Preheating zone length | 450mm |
Preheating zone number | 1 |
Preheating temperature | Room temperature~250℃ |
Wave | Dual wave |
Conveyor path gradient | 3~7° |
Solder type | Lead free /lead tin |
Solder volume | 160kg |
Solder temperature | Room temperature~350±1℃ |
Solder tank size | 650*260*155mm |
Temperature control type | P.I.D |
Solder flux | 10~100ml/min |
Refrigeration temperature | Below 10℃ |
Sprayer Moving type | SMC cylinder |
Power | 3P 5 Wires (5W,3P) 380V |
Power for heating up | 9kw |
Power for operation | Approx.3kw |
Air supply | 3kg/cm2 |
Weight | Approx.300kg |
Dimensions L*W*H | 2200*1200*1600mm |
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