描述
Medium lead free wave soldering machine
Features
1.Open type streamline shell design, beautiful appearance, easy to clean up.
2.The solder furnace is made of alloy material. High strength and high hardness special aluminum alloy guide, long service life.
3.The touch screen + professional PLC control technology is used to ensure the reliability and stability of the system.
4.step spray device, can be automatically adjusted with the width of PCB, effectively saving the economic process.
5. Tin wave peak adopts electronic stepless frequency control, independent control of wave height.
6.Isolation device, flux smoke from the exclusive exhaust and recovery channels to meet the environmental requirements.
7.Users can automatically set the date, time, temperature control parameters of the automatic switchgear.
8.Micro chemical pump, propanol cleaning agent, automatic circulation cleaning chain claw.
9.The three section of independent preheating, hot wire device, fully stimulate the activity of flux, and get good welding effect. The heat is directly radiated to the bottom of the PCB plate, and the heat is fast and the service life is long.
10.Die-casting alloy claw, no sticky tin, no deformation, long life, transport PCB stable and reliable.
11.The whole process of transparent observation window is convenient to observe the production and maintenance operation.
12.The transport system adopts variable frequency speed control, PID closed loop control, and the transportation speed is stable.
13.The stored parameters can be invoked quickly, and the operating variables set the process consistency in PCB.
14.Meet PCB auto wave,to minimize the amount of tin oxidation.
15.The temperature control system adopts the closed loop control mode of PID, and the temperature control is stable and reliable. Short circuit and overcurrent protection system.
16. The operating system has a huge memory window program that improves the automated production and management records to a higher level.
Specifications
| Model | OB-W330B | |||||||
| Dimensions | 2600*1200*1600mm | |||||||
| PCB size | 0-250mm(adjust) | |||||||
| PCB conveyor height | 760±20mm | |||||||
| PCB conveyor speed | 0-2.0m/min | |||||||
| Preheating zone length | 800mm(two section) | |||||||
| Preheating zone qty | 1 | |||||||
| Preheating temperature | Room temp-250℃ | |||||||
| Solder capacity | 180Kgs | |||||||
| Solder temperature | Room Temp～350℃ | |||||||
| Temperature control method | Touch screen+ PID | |||||||
| Flux storage tank | Max5.2L | |||||||
| Power | 3P 5W 380V | |||||||
| Power for heating up | 12KW | |||||||
| Wave | Dual wave | |||||||
| Air source | 4-7kg/cm2 12.5L/min | |||||||
| Weight | Approx.750Kgs | |||||||
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