描述
Mini wave soldering machine
Features
- open canopy-style streamlined shell design, beautiful appearance, easy to clean.
- The lead-free solder furnace made of stainless steel production. High strength and hardness special aluminum rails, long lifespan;
- Applies to the PLC + touch screen controller, Ensure system reliability and stability;
- Spray system applies to the step motor , it can adjust the width according to the PCB size , save solder flux;
- Wave soldering stove adopt stepless electronic frequency control, it can independently control the wave height.
- The unique flux isolated device, flux fumes from the exhaust and recycling channel dedicated discharge, to meet environmental requirements.
- Programmable Automatic Turning the date, time, temperature and other parameters.
- equipped with a cooling module, the temperature compensation module, and a variety of process requirements for lead-freetechnique;
- The ceramic heating pipe preheating unit, fully stimulate the flux activity, to obtain good welding results. Radiation heat directly to the bottom of the PCB, heat, long life.
- Patented die-cast claw-type chain, titanium, non-stick tin, never deformation, long life, smooth and reliable transport PCB.
- The entire process transparent observation window for easy observation of the manufacturing and maintenance operations.
- Transportation system with stepless electronic speed control, PID control, transport speed and stability.
- Automatic start wave when go through the PCB, to minimize the amount of tin oxide.
- The temperature control system uses closed-loop PID control, temperature stable and reliable.
- With short circuit and overcurrent protection system.
Specifications
| Model | OB-W330 |
| PCB conveyor height | Max.760±10mm |
| PCB conveyor direction | L-R |
| PCB conveyor speed | 0-2.0m/min |
| PCB Working width | 0～200mm adjustable (standard) |
| Preheating zone length | 400mm |
| Preheating zone number | 1 |
| Preheating temperature | Room temperature～250℃ |
| Wave | Dual wave |
| Conveyor path gradient | 3～7° |
| Solder type | Lead free /lead tin |
| Solder volume | 135kg |
| Solder temperature | Room temperature～350±1℃ |
| Solder tank size | 550*260*145mm |
| Temperature control type | P.I.D |
| Solder flux | 10～100ml/min |
| Refrigeration temperature | Below 10℃ |
| Sprayer Moving type | SMC cylinder |
| Power | 3P 5 Wires (5W,3P) 380V |
| Power for heating up | 8kw |
| Power for operation | Approx.2.5kw |
| Air supply | 3kg/cm2 |
| Weight | Approx.300kg |
| Dimensions L*W*H | 2100*1050*1450mm |
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